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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input AND Gate
The MC74VHC08 is an advanced high speed CMOS 2-input AND gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7V, allowing the interface of 5V systems to 3V systems. * * * * * * * * * * * High Speed: tPD = 4.3ns (Typ) at VCC = 5V Low Power Dissipation: ICC = 2A (Max) at TA = 25C High Noise Immunity: VNIH = VNIL = 28% VCC Power Down Protection Provided on Inputs Balanced Propagation Delays Designed for 2V to 5.5V Operating Range Low Noise: VOLP = 0.8V (Max) Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300mA ESD Performance: HBM > 2000V; Machine Model > 200V Chip Complexity: 24 FETs or 6 Equivalent Gates
MC74VHC08
D SUFFIX 14-LEAD SOIC PACKAGE CASE 751A-03
DT SUFFIX 14-LEAD TSSOP PACKAGE CASE 948G-01
LOGIC DIAGRAM
1 3 2 4 6 5 9 8 10 12 11 13 Y4 Y3 Y2 Y = AB Y1
M SUFFIX 14-LEAD SOIC EIAJ PACKAGE CASE 965-01
ORDERING INFORMATION MC74VHCXXD MC74VHCXXDT MC74VHCXXM SOIC TSSOP SOIC EIAJ
A1 B1 A2 B2 A3 B3 A4 B4
FUNCTION TABLE
Inputs A L L H H B L H L H Output Y L L L H
Pinout: 14-Lead Packages (Top View)
VCC 14 B4 13 A4 12 Y4 11 B3 10 A3 9 Y3 8
1 A1
2 B1
3 Y1
4 A2
5 B2
6 Y2
7 GND
6/97
(c) Motorola, Inc. 1997
1
REV 1
II I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I I I I I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I II II I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I I II II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II II I I I I I I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I II I I IIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIII I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII III I III I I II I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III I I IIIIIIIIIIIIIIIIIIIIIII III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I I
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute-maximum-rated conditions is not implied. Derating -- SOIC Packages: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C
II I I IIIIIIIIIIIIIIIIIIIIIII I I I I I I III I I IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII
MC74VHC08
MAXIMUM RATINGS*
Symbol VCC Vout Tstg ICC IOK Iout Vin PD IIK Storage Temperature Power Dissipation in Still Air, DC Supply Current, VCC and GND Pins DC Output Current, per Pin Output Diode Current Input Diode Current DC Output Voltage DC Input Voltage DC Supply Voltage Parameter SOIC Packages TSSOP Package - 0.5 to VCC + 0.5 - 65 to + 150 - 0.5 to + 7.0 - 0.5 to + 7.0 Value - 20 50 25 20 500 450 Unit mW mA mA mA mA
DC ELECTRICAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
MOTOROLA Symbol S bl Symbol VOH VCC VOL Vout VIH tr, tf VIL Vin TA Maximum Low-Level Output Voltage Minimum High-Level Output Voltage Maximum Low-Level Input Voltage Minimum High-Level Input Voltage Input Rise and Fall Time Operating Temperature DC Output Voltage DC Input Voltage DC Supply Voltage Parameter P Parameter Vin = VIH or VIL IOL = 4mA IOL = 8mA Vin = VIH or VIL IOL = 50A Vin = VIH or VIL IOH = - 4mA IOH = - 8mA Vin = VIH or VIL IOH = - 50A Test C di i T Conditions VCC = 3.3V 0.3V VCC = 5.0V 0.5V
2.0 3.0 to 5.5
2.0 3.0 to 5.5
VCC V
3.0 4.5
2.0 3.0 4.5
3.0 4.5
2.0 3.0 4.5
2 - 40 Min 2.0 0 0 0 0 1.50 VCC x 0.7 2.58 3.94 Min 1.9 2.9 4.4 VCC + 85 Max 100 20 5.5 5.5 TA = 25C ns/V Unit
_C
_C
Typ
V
V
V
V
V
V
0.0 0.0 0.0
2.0 3.0 4.5
0.50 VCC x 0.3
0.36 0.36
Max
0.1 0.1 0.1
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open.
VHC Data - Advanced CMOS Logic DL203 -- Rev 1 1.50 VCC x 0.7 TA = - 40 to 85C 2.48 3.80 Min 1.9 2.9 4.4
v
0.50 VCC x 0.3
0.44 0.44 Max 0.1 0.1 0.1
v
Unit Ui
V V V V
MC74VHC08
II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II I I II II I II II I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II I I I II I I I I I I II II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II II I I I I II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II I I I I I I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II II I II II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
DC ELECTRICAL CHARACTERISTICS
Symbol Iin Parameter Test Conditions VCC V TA = 25C Typ TA = - 40 to 85C Min Max 1.0 20.0 Min Max Unit A A Maximum Input Leakage Current Vin = 5.5V or GND 0 to 5.5 5.5 0.1 2.0 ICC Maximum Quiescent Supply Current Vin = VCC or GND
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol S bl tPLH, tPHL Parameter P
TA = 25C Typ 6.2 8.7 4.3 5.8 4
TA = - 40 to 85C Min 1.0 1.0 1.0 1.0 Max
Test C di i T Conditions
Min
Max
Unit Ui ns
Maximum Propagation Delay, A or B to Y
VCC = 3.3 0.3V VCC = 5.0 0.5V
CL = 15pF CL = 50pF CL = 15pF CL = 50pF
8.8 12.3 5.9 7.9 10
10.5 14.0 7.0 9.0 10
Cin
Maximum Input Capacitance
pF
Typical @ 25C, VCC = 5.0 V
CPD Power Dissipation C P Di i i Capacitance (N i (Note 1 ) 1.) pF F 18 1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC / 4 (per gate). CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
NOISE CHARACTERISTICS (Input tr = tf = 3.0 ns, CL = 50pF, VCC = 5.0 V)
TA = 25C Symbol S bl VOLP VOLV VIHD VILD Characteristic Ch ii Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Minimum High Level Dynamic Input Voltage Maximum Low Level Dynamic Input Voltage Typ 0.3 - 0.3 Max 0.8 - 0.8 3.5 1.5 Unit Ui V V V V
VCC A or B 50% GND tPLH tPHL DEVICE UNDER TEST OUTPUT
TEST POINT
CL*
Y
50% VCC *Includes all probe and jig capacitance
Figure 1. Switching Waveforms
Figure 2. Test Circuit
INPUT
Figure 3. Input Equivalent Circuit
VHC Data - Advanced CMOS Logic DL203 -- Rev 1
3
MOTOROLA
MC74VHC08
OUTLINE DIMENSIONS
D SUFFIX PLASTIC SOIC PACKAGE CASE 751A-03 ISSUE F
-A-
14 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
-B-
1 7
P 7 PL
0.25 (0.010)
M
B
M
G C
R X 45
F
SEATING PLANE
D
14 PL
K
M
M B
S
J
0.25 (0.010)
T
A
S
DIM A B C D F G J K M P R
MILLIMETERS MIN MAX 8.75 8.55 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 5.80 6.20 0.25 0.50
INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 7 0 0.228 0.244 0.010 0.019
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948G-01 ISSUE O
14X K REF NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
N
2X
L/2
14
8
0.25 (0.010) M
L
PIN 1 IDENT. 1 7
B -U-
N F DETAIL E K K1 J J1
0.15 (0.006) T U
S
A -V-
SECTION N-N -W-
C 0.10 (0.004) -T- SEATING
PLANE
D
G
H
DETAIL E
MOTOROLA
4
EEE CCC EEE CCC
VHC Data - Advanced CMOS Logic DL203 -- Rev 1
MC74VHC08
OUTLINE DIMENSIONS
M SUFFIX PLASTIC SOIC EIAJ PACKAGE CASE 965-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 1.42 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.056
14
8
LE Q1 E HE M_ L DETAIL P
1
7
Z D e A VIEW P
c
b 0.13 (0.005)
M
A1 0.10 (0.004)
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VHC Data - Advanced CMOS Logic DL203 -- Rev 1
5
MC74VHC08/D MOTOROLA


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